Electroplating apparatus
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United States of America Patent
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-
Aug 15, 1995
Grant Date -
N/A
app pub date -
Dec 6, 1993
filing date -
Dec 7, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electroplating apparatus capable of forming a film of a uniform thickness on a substrate for printed wiring irrespective of a size of the substrate. Insoluble anode plates are arranged in a plurality of pairs in an electroplating tank in a manner to be juxtaposed to each other along a transfer passage along which the substrate is horizontally transferred and electrically independent from each other for every pair. The insoluble anode plates in each pair are arranged so as to be vertically spaced from each other with the transfer passage being interposed therebetween and are independently connected to an anode terminal of each of rectifiers. Cathode terminals of the rectifiers are electrically connected together to clips for holding the substrate. Electroplating on the substrate is carried out by feeding only the insoluble anode plates contained in a plane of projection of the substrate defined in a vertical direction of the substrate with electricity.
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