Single semiconductor substrate RAM device utilizing data compressing/expanding mechanism in a multi-microprocessor environment

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United States of America Patent

PATENT NO 5440718
SERIAL NO

08308848

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Abstract

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Compressor/expander circuits which are built in a common semiconductor substrate along with a random access memory unit function so as to realize compression/expansion processes merely through the internal data transfer controls between the circuits and the random access memory unit as based on built-in control unit. This endows the temporary storage of data and the compression/expansion processes hereof with continuities, and achieves higher speeds for the compression/expansion processes.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTD6-6 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 100-8280

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fuse, Yasuyuki Koganei, JP 1 13
Kikuchi, Takashi Akishima, JP 157 1758
Kumagai, Takehiko Tokyo, JP 1 13
Okubo, Takao Akishima, JP 16 862

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