Polyamic acid composite, polyimide composite and processes for producing the same

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United States of America Patent

PATENT NO 5438105
SERIAL NO

08202872

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Abstract

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A polyamic acid composite comprising i) a polyamic acid having three dimensional network molecular structure obtained by a ring-opening polyaddition reaction of a tetracarboxylic acid dianhydride with an aromatic diamine and a tri- or tetramino compound and ii) (a) a high polymer component having a different molecular structure from the polyamic acid, which is dispersed in the three dimensional network molecular structure of the polyamic acid and of which molecular chains are interpenetrated with molecular chains of the polyamic acid or (b) a curable resin composition which is dispersed in the three dimensional network molecular structure of the polyamic acid and which is capable of forming a cured resin of which molecular chains are interpenetrated with molecular chains of the polyamic acid, and a polyimide composite obtained from the polyamic acid composite, and process for production thereof.

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Patent Owner(s)

Patent OwnerAddress
TOHO RAYON CO LTDCHUO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagata, Yasuhisa Shizuoka, JP 11 191

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