Hybrid/microwave enclosures and method of making same
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United States of America Patent
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Jul 25, 1995
Issued Date -
N/A
app pub date -
Jul 17, 1992
filing date -
Sep 27, 1990
priority date (Note) -
Expired
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Abstract
A method of forming enclosures for microwave and hybrid devices and the enclosure itself wherein the metals to be joined are thin (i.e., less than 40 mils thick) and/or thick (up to several inches) and wherein metallurgical hermetic bonds are provided between adjacent metals which are generally difficult to bond to each other and may be bonded by a select number of bonding processes.
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