Importance

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Abstract

A high I/O count integrated circuit is disposed on a semiconductor chip having opposing faces and comprises a plurality of functional circuit modules, each having inputs and at least one output having a first drive capability. A plurality of a first type of I/O nodes, each comprising a first conductive structure is disposed in a first I/O node array on the surface of a first one of the semiconductor chip faces. A plurality of a second type of I/O nodes, each comprising a first conductive structure is disposed on the first semiconductor chip face. An interconnect architecture comprising a plurality of conductors is superimposed on the functional circuit modules, the interconnect architecture comprises a plurality of interconnect conductors. Selected ones of the interconnect conductors are connectable to the inputs and at least one output of selected ones of the functional circuit modules by electrically programmable user-programmable interconnect elements. Selected ones of the interconnect conductors are connectable to other selected ones of the interconnect conductors by user-programmable interconnect elements. Selected ones of the interconnect conductors are connectable to the first I/O nodes by electrically programmable user-programmable interconnect elements. Selected ones of the interconnect conductors are connectable to the second I/O nodes by electrically programmable user-programmable interconnect elements.

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First Claim