Socket for IC package
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United States of America Patent
Stats
-
Jul 11, 1995
Grant Date -
N/A
app pub date -
Jul 11, 1994
filing date -
Jul 13, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A receiving tray 6 is disposed on a pedestal surface 1a of a base member 1 vertically and movably, while below the pedestal surface 1a are disposed a push-up member 7 interlocked with the receiving tray and a spring 8 for urging the push-up member 7 downwards. A seating surface if for package leads P2 is formed along side portions of the pedestal surface 1a, and a large number of contacts 2 are arranged side by side, the contacts 2 having respective contact portions 2a for contact with the leads P2 which contact portions 2a are urged inwards to obtain a predetermined contact pressure for the leads. There are used movable cams 4 adapted to rotate upon depression of a cover 5 which covers the base member, to displace the contact portions 2a of the contacts 2 outwards away from the package leads P2. The movable cams 4 are each provided with an actuating arm 4c which comes into abutment with the push-up member 7 upon depression of the cover 5 and consequent rotation of the cam 4 to push up the receiving tray 6.
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