Wallboard bundling tape and method
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United States of America Patent
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-
Jul 11, 1995
Issued Date -
N/A
app pub date -
Jul 11, 1994
filing date -
Jan 3, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A bundling tape has two rows of perforations extending from one end of the tape to the other; the perforations are arranged inward of and substantially parallel to the edges. A first band is formed between one edge and a first row of perforations, and a second band is formed between the other edge and the second row of perforations; between the two rows of perforations is a center band tear strip. The bands have co-planar upper and lower surfaces. A laminated bundling tape embodiment also has an additional zipper tape attached to the lower surface of the center band, and apparatus and methods are described for making this laminated tape. Bundles of material, such as wallboard, are fastened together by adhering the bottom surface of the first band to the uppermost sheet of material, and by adhering the bottom portion of the second band to the lowermost sheet.
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