Method for forming printed circuits by elctroplating

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5429738
SERIAL NO

08068534

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method and apparatus for continuously forming primed circuits, the apparatus including a cylindrical drum rotatable about a generally vertical axis and a tank for holding an electrolytic plating solution. The tank is dimensioned to surround a lower portion of the drum and immerse the lower portion of the drum in the electrolytic plating solution. Means for introducing electrolytic solution into the tank are provided, and a plurality of metallic anodes are disposed within the tank surrounding and facing the lower portion of the drum defining a generally uniform gap therebetween. A plurality of cathodes are disposed above the tank and facing an upper portion of the drum, the cathodes being biased toward the drum. The apparatus is adapted to receive a movable continuous flexible web having a thin layer of conductive metal on one side thereof. The metal layer is masked to expose a plurality of patterns aligned along the web and a continuous strip of exposed metal along one edge of the web. The web is to be positioned against the drum with the metal layer facing away therefrom and with the exposed patterns extending into the gap and facing the anodes. The continuous strip of exposed metal is above the tank and facing the cathodes wherein the cathodes are biased into electrical contact therewith as the web moves through the apparatus.

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Patent Owner(s)

Patent OwnerAddress
NIKKO MATERIALS USA INC125 NORTH PRICE ROAD CHANDLER AS 85224

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beyerle, Richard A Chesterland, OH 4 30
Plascak, Robert J Schaumburg, IL 2 29

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