Flow sensor
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United States of America Patent
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Jun 13, 1995
Grant Date -
N/A
app pub date -
Jun 18, 1993
filing date -
Jun 18, 1993
priority date (Note) -
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Abstract
A flow sensor for sensing heat conduction with a high-speed response, and manufactured by applying IC micro-machining technology to have a reduced clearance between the heating portion and the sensing portion. The flow sensor has a substrate having a through hole or a cavity formed therein, whereon a heating portion and a sensing portion are formed each in the form of a layer bridged over the through hole or the cavity and supported at both ends or at one end. The heating portion and the sensing portion are laminated in two or three or more layers spaced from each other and arranged along the flow of gas to be measured. Each inner layer space is fine and accurate by precisely forming a very thin film that is removable.
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