Method of planarizing microstructures
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United States of America Patent
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May 30, 1995
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app pub date -
Nov 17, 1993
filing date -
Nov 17, 1993
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Abstract
A method of planarizing a microstructure (16) includes the steps of providing a layer (18) of material over the microstructure (16) such that an overcoating surface (20) is formed, measuring the thickness of the layer (18) across the surface (20) forming a dwell time versus position map and removing material from the layer (18) of material by use of a plasma assisted chemical etching tool in accordance with the dwell time versus position map.
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