Soldering flux
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United States of America Patent
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May 23, 1995
Grant Date -
N/A
app pub date -
Aug 15, 1994
filing date -
Feb 16, 1994
priority date (Note) -
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Abstract
A soldering flux comprising a bis (2-oxazoline) compound, a dithiol compound, an organic carboxylic acid compound and an activator which does not require post-soldering cleaning and, yet, does not cause corrosion of the base metal or deterioration of electrical characteristics and helps to clear the statutory regulations on the use of chlorofluorohydrocarbons. A soldering flux comprising, in addition to the above components, an organic solvent, a thermoplastic resin or/and an epoxy group-containing compound.
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