Method of blasting IC frames and apparatus therefore
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United States of America Patent
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May 16, 1995
Grant Date -
N/A
app pub date -
Dec 8, 1993
filing date -
Jun 20, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of blasting IC frames as electronic components with a suitable apparatus, which prevents the frames from being caught by position restriction means during transfer, and eleiminates necessity for particular operations even if frames of different widths are continuously fed. The blasting is carried out by turning a conveyor belt (8), which has support plate members (11) juxtaposed thereon and has a support groove (D) of an inverted triangular sectional shape formed thereon, jetting slurry onto the IC frames (F) merely placed on the slope surfaces inside the support support groove from a nozzles (2), turning then the frames by a reversion device (3) so as to place them on other slope surfaces, and jetting the slurry from other nozzles.
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