Cemented carbide substrate having a diamond layer of high adhesive strength
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 16, 1995
Grant Date -
N/A
app pub date -
Mar 24, 1994
filing date -
Mar 26, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved process for improving the adhesion between a cemented carbide substrate and a diamond layer deposited thereon by removing the binder phase of the cemented material from the surface of the substrate prior to diamond coating. For this purpose, the process of the invention uses an apparatus as is conventionally used in various technologies for the CVD process of diamond layers. The process parameters are here altered from those of the conventional diamond coating in such a way that binder metal is evaporated from a very narrow boundary zone of the substrate surface, utilizing the reaction heat from the recombination of previously dissociated hydrogen gas directly at the substrate surface.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully