Method for making heat-dissipating elements for micro-electronic devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 9, 1995
Issued Date -
N/A
app pub date -
May 20, 1993
filing date -
Apr 14, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
High density heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of copper and at least one other denser material such as tungsten and/or molybdenum, the proportions of which are adjusted to match the thermal expansion characteristics of the microcircuit material. The pressed compacts are then heated in a sintering furnace at 1,200.degree. C. to 1,350.degree. C. in order to effect an homogeneous distribution of the melting copper throughout the structure. The process results in a readily usable component having good thermal conductivity and matched thermal expansion that requires no further machining.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully