Integrated socket and IC package assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 9, 1995
Grant Date -
N/A
app pub date -
Apr 27, 1993
filing date -
Apr 27, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit package for demountable attachment to a printed circuit board or like device is formed from an integrated assembly of an IC chip and socket, The IC chip is permanently mounted to a chip carrier which spreads the contact area from a first area to a larger second area. The chip carrier or spreader is contained in a plastic socket formed of a cover and a base. The base has an array of apertures therethrough each of which is equipped with wadded wire/plunger contacts for conformal contact with both pads on the bottom of the chip carrier and pads on a circuit board.
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