Importance

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Abstract

A method of fabricating thin-film magnetic recording heads or 'sliders' employs the step of slicing a wafer containing like-oriented transducers into chunks, each chunk containing at least a minimum number of rows of transducers such that the amount of bow induced in the chunk is minimized. Following the chunk slice, one of two methods may be followed to yield precisely-lapped single rows of sliders. In the first method, the chunk is bonded to a rigid support piece at one end, and to a rigid carrier tool at the other. The row bonded to the carrier is then sliced away from the chunk and lapped while attached to the carrier. The steps of bonding, slicing, and lapping are then repeated for each row in the chunk. In the second method, the chunk is bonded to a rigid carrier tool at one end, and the row at the other end is then lapped and sliced off. The steps of lapping and slicing are repeated for each row in the chunk. In either method, rows are never lapped before being separated from a rigid workpiece, so that additional bow is not introduced prior to lapping the row.

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First Claim