Insulating adhesive tape, and lead frame and semiconductor device employing the tape
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United States of America Patent
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Apr 11, 1995
Grant Date -
N/A
app pub date -
Nov 29, 1993
filing date -
Dec 4, 1992
priority date (Note) -
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Abstract
An insulating adhesive tape which comprises a base supporting film and an adhesive layer formed on at least one surface thereof, said adhesive layer being formed of a thermoplastic polymer comprising a thermoplastic polyimide, wherein said thermoplastic polymer has a glass transition temperature ranging from 180.degree. C. to 280.degree. C. and an elastic modulus ranging from 10.sup.10 dyne/cm.sup.2 to 10.sup.11 dyne/cm.sup.2 at 25.degree. C., said modulus including a value ranging from 10.sup.2 dyne/cm.sup.2 to 10.sup.9 dyne/cm.sup.2 at a temperature between 250.degree. C. and 300.degree. C.
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