Circuit board for high pin count surface mount pin grid arrays
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United States of America Patent
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Mar 28, 1995
Issued Date -
N/A
app pub date -
Feb 2, 1994
filing date -
Sep 18, 1992
priority date (Note) -
Expired
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Abstract
A method for fabricating a printed circuit board for high pin count surface mount pin grid arrays is provided where surface mount pads for soldering a surface mount pin grid array package are isolated by solder mask layers. The printed circuit board is laminated with one or more solder mask layers containing apertures therein to expose the surface mount pad locations.
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