Method of fabricating conductive structures on substrates
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United States of America Patent
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Mar 21, 1995
Grant Date -
N/A
app pub date -
Dec 18, 1992
filing date -
Dec 18, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is an integrated heat sink module and a method of fabricating conductive structures on a substrate. The method of the present invention includes cleaning a substrate material to remove any impurities present on the substrate surface. The method further includes placing a protective layer resilient to chemicals used in conductive structure formation, on a first surface. The first surface is opposite a second surface on which conductive structures are formed. The method includes forming conductive structures on the second surface of the substrate. The protective layer is then removed from the first surface of the substrate.
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