Resin composition containing low-molecular weight compounds which form a polyester urethane hybrid network
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United States of America Patent
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Feb 28, 1995
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app pub date -
Dec 28, 1992
filing date -
Jan 6, 1990
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Abstract
The invention relates to a resin composition containing low-molecular compounds which form a polyester urethane hybrid network. The resin composition contains a first component consisting of a condensation product of at least one diol and at least one unsaturated dicarboxylic acid material, a second component containing an ethylenically unsaturated monomer capable of copolymerizing with the first component, and a third component consisting of a polyisocyanate. The first component substantially consists of a diester compound of 2 diol molecules and 1 molecule of a dicarboxylic acid material, which dicarboxylic acid material consists of at least 75% of .alpha.-, .beta.-unsaturated dicarboxylic acid.
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