Rivet design for enhanced copper thick-film I/O pad adhesion
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United States of America Patent
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Feb 14, 1995
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N/A
app pub date -
Dec 21, 1992
filing date -
Dec 21, 1992
priority date (Note) -
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Abstract
A ceramic circuit card (10) for a missile utilizing a 'rivet' design and a method for making the same wherein thick-film copper I/O pads (15) are fabricated on a first dielectric layer (13) and on the upper surface of conducting material (20) in vias (14) formed in the dielectric layer (13). A first conductor layer (11) is printed directly on an alumina ceramic layer (12). The dielectric layer (13) is then printed on the first conductor layer (11) and on the alumina ceramic layer (12). During operation, each I/O pad (15) has attached to it a flex harness (21) for connecting the card (10) to a printed wiring board (22) on which the card (10) is mounted. The ceramic circuit card (10) is further comprised of additional dielectric and conductor layers in an alternating stacked arrangement. The top conductor layer is used to connect the circuit card to other electrical components.
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