Method for manufacturing semiconductor devices using heat-treatment vertical reactor with temperature zones
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 7, 1995
Grant Date -
N/A
app pub date -
Oct 22, 1992
filing date -
Oct 23, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
A wafer(s) for producing semiconductor devices is subjected to heat treatment in a vertical thermal reactor, which is provided with an electric heating means setting a first temperature and another electric heating means setting a second temperature higher than the first temperature. The wafer(s) is moved upwards and is subected to a treatment in the second region of the vertical thermal reactor; and, is reverted to the first region. Rapid thermal processing of 6 or 8 inch wafer(s) is possbile without causing slip lines.
First Claim
Other Claims data not available
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 47 Citation Count
- H01L Class
- 89.79 % this patent is cited more than
- 30 Age