Metal-ceramic joint
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United States of America Patent
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Feb 7, 1995
Grant Date -
N/A
app pub date -
Apr 3, 1992
filing date -
Apr 6, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process is described for electrolessly depositing or electrodepositing a solder layer composed of copper and silver and having an overall composition of silver/copper of from 75:25 to 70:30 and a total layer thickness of 15 to 100 .mu.m on a metallized ceramic. In this process, copper layers and silver layers are deposited alternately on the metallized ceramic. The number of layers is at least 3 and the individual layer thickness is 5 to 10 .mu.m.
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