Manufacturing integrated circuit cards
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United States of America Patent
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-
Feb 7, 1995
Issued Date -
N/A
app pub date -
Aug 28, 1991
filing date -
Jun 21, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An integrated circuit card is manufactured by reaction injection moulding around the insert bearing the electronic components, and between high tensile skins which form opposed surfaces of the card. Apparatus is disclosed for the continuous manufacture of the cards between a pair of moving belts.
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