Socket for IC package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5387118
SERIAL NO

08103756

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A socket for an IC package includes a base member having a receptacle space for the IC package, a plurality of contacts arranged in parallel along the sides of the receptacle space of the base member. The contacts each have a contact portion for contact with a corresponding lead of the IC package received in the receptacle space. A spring portion urges the contact portion inwardly to obtain a contact pressure against a lead. A connecting shaft is pivotally supported vertically along each row of the contacts, and is associated with the contacts. A cover covers the base member, and the connecting shaft pivots by depression of the cover to displace the contact portion of each contact outwardly away from the corresponding lead of the IC package against a biasing force of the spring portion. The contact has a curved, first spring portion extending upwardly and inwardly from an inside edge of a plate portion. A second spring portion is bent inwardly from a front end of the first spring portion and is contiguous to the contact portion, and a projection is formed on an upper surface of the second spring portion. The connecting portion has an engaging recess for engagement with the projection and also has an engaging face for engagement with the portion behind the projection. The cover includes inclined surface for allowing the movable cams to move pivotally outwardly.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
CHICHIBU FUJI CO LTD755-1 OGANO OGANO-MACHI CHICHIBU-GUN SAITAMA 368-0193

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoshi, Makoto Saitama, JP 2 16
Kishi, Nobuaki Saitama, JP 5 67
Matsuo, Ichiro Saitama, JP 16 75
Osawa, Tetsuya Saitama, JP 3 79

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