Filler-containing resin composition and stretched films using same

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United States of America Patent

PATENT NO 5385972
SERIAL NO

08166076

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Abstract

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A filler-containing resin composition containing component A, which is an ethylene copolymer having (a) a melt flow rate (MFR) of 0.01 to 20 g/10 min.; (b) a density D of not more than 0.935 g/cm.sup.3 ; (c) a single peak of elution volume corresponding to a temperature within a range from 30 to 100.degree. C. with the elution curve satisfying a relationship in which the ratio H/W is not less than 1 when H represents the height of the peak and W represents the width of the elution curve at 1/2 H; and (d) an elution volume Y wherein (1) Y.ltoreq.-4500D+4105 when the density D of the component A is less than 0.91 g/cm.sup.3, but Y.ltoreq.100; or (2) Y.ltoreq.10 when the density D of the component A is not less than 0.91 g/cm.sup.3 ; and component B, which is a particulate inorganic filler having an average particle size of not more than 10 .mu.m, and a bulk density of 0.1 to 0.7 g/cm.sup.3 ; is provided which can be readily formed by stretching, and that is advantageously usable for the formation of thin formed bodies having excellent elastic recovery, strength and feeling, and also having very excellent gas-permeability.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI PETROCHEMICAL CO LTD5-2 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikeno, Hajime Yokkaichi, JP 9 171
Shichijo, Keiko Yokkaichi, JP 8 173
Yamamoto, Koji Yokkaichi, JP 384 3625

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