Combined RF and digital/DC signalling interconnect laminate
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United States of America Patent
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Jan 24, 1995
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N/A
app pub date -
Jan 26, 1993
filing date -
Jan 26, 1993
priority date (Note) -
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Abstract
An interconnect laminate structure integrates RF and auxiliary (e.g. digital and D.C.) signalling capabilities in a common structure by means of a stacked conductor-plated dielectric configuration that facilitates access to and routing by channelline/waffleline RF transmission links and separate control (e.g. digital, power supply) links, without having to perform laborious manual routing tasks to effect auxiliary connectivity among the components of a network. The interconnect structure includes a first dielectric layer having a channel formed in a first surface thereof, the channel having a conductive surface and configured to accommodate the insertion of a dielectric coated conductor into the channel so as to form an RF transmission line. Second dielectric layers, each of which has a conductive layer formed on a first surface thereof, are mounted together with the first dielectric layer in a laminate assembly. Respective layers of adhesive are interleaved with the plurality of second dielectric layers together with the first dielectric layer in a laminate assembly.
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