Printed circuit structure including power, decoupling and signal termination
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United States of America Patent
Stats
-
Jan 24, 1995
Issued Date -
N/A
app pub date -
Mar 16, 1993
filing date -
Oct 29, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board includes an array of conductive pads including component-mounting holes disposed on first and second surfaces thereon. An array of conductive attachment lands arranged in pairs of first and second attachment lands are disposed on the first and second surfaces. The first and second attachment lands are insulated from one another and separated by a distance selected to allow attachment of standard sized components therebetween on the first and second surfaces of said circuit board. First and second conductive power distribution planes are disposed on the first and second surfaces and are insulated from the conductive pads and the second attachment lands disposed thereon. The first attachment land of each pair on the first surface of the circuit board is electrically connected to the first power distribution plane and the first attachment land of each pair on the second surface of the circuit board is electrically connected to the second power distribution plane, and the second attachment land of each pair on the first and second surfaces of the circuit board electrically connected to one of the conductive pads.
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