Fine wire for forming bump electrodes using a wire bonder
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 24, 1995
Issued Date -
N/A
app pub date -
Oct 30, 1992
filing date -
Jan 30, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully