Fine wire for forming bump electrodes using a wire bonder
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 24, 1995
Issued Date -
N/A
app pub date -
Oct 30, 1992
filing date -
Jan 30, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
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Abstract
This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.
First Claim
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