Integrated circuit package with direct access to internal signals
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United States of America Patent
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Jan 24, 1995
Issued Date -
N/A
app pub date -
Apr 27, 1993
filing date -
Apr 27, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A package for one or more integrated circuit dice which includes a spreader which provides a conventional signal path between the die and a printed circuit board to which it is demountably attached as well as an additional, more readily accessible subset of signals, preferably available through a flexible cable extending horizontally from the package. The spreader provides a first set of contacts on a first side for interface to the integrated circuit dice, a second set of contacts on a second side opposite the first side which are connected to some of the contacts of the first set of contacts for connection to the printed circuit board, and a third set of contacts on the first side along one edge thereof for engaging the flexible cable and carrying the subset of signals.
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