Stage having electrostatic chuck and plasma processing apparatus using same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 17, 1995
Grant Date -
N/A
app pub date -
Dec 17, 1993
filing date -
Dec 17, 1992
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A plasma etching apparatus for a semiconductor wafer includes a susceptor arranged in a vacuum process chamber. A groove for flowing a heat transfer gas is formed in the mounting surface of the susceptor. The groove includes an annular groove portion formed along the peripheral edge of the mounting surface, and a gas path vertically extending through the susceptor is connected to the annular groove portion. A sheet-like electrostatic chuck is airtightly adhered to the mounting surface of the susceptor to cover the groove. A plurality of through holes are formed in the electrostatic chuck, and these holes are arranged along an above the groove. The heat transfer gas is supplied between the electrostatic chuck and the semiconductor wafer through the gas path, the groove, and the through holes. The heat transfer gas contributes to transfer of cold from a liquid nitrogen source arranged under the susceptor to the wafer.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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TOKYO ELECTRON LIMITED | TOKYO |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Arai, Izumi | Yokohama, JP | 24 | 3954 |
# of filed Patents : 24 Total Citations : 3954 | |||
Ishikawa, Kenji | Sagamihara, JP | 69 | 2552 |
# of filed Patents : 69 Total Citations : 2552 | |||
Iwata, Teruo | Nirasaki, JP | 29 | 1917 |
# of filed Patents : 29 Total Citations : 1917 | |||
Komino, Mitsuaki | Tokyo, JP | 31 | 3733 |
# of filed Patents : 31 Total Citations : 3733 | |||
Mitui, Tadashi | Yamanashi, JP | 1 | 855 |
# of filed Patents : 1 Total Citations : 855 | |||
Tahara, Yoshifumi | Tokyo, JP | 24 | 2392 |
# of filed Patents : 24 Total Citations : 2392 |
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Patent Citation Ranking
- 855 Citation Count
- H01L Class
- 98.49 % this patent is cited more than
- 30 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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