Process for electroless gold plating
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United States of America Patent
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Jan 10, 1995
Issued Date -
N/A
app pub date -
Sep 29, 1993
filing date -
Feb 22, 1991
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Abstract
A process for electroless gold plating using plating solution comprizing cyanoaurate, alkaline cyanide, reducing agent, alkaline hydroxide, crystal condition controlling agent and stabilizer characterized in that an aldehyde or a ketone compound is added together with replenished gold salt, and hydrogen peroxide is also added, if necessary.
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