Process for producing a printed circuit board
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United States of America Patent
Stats
-
Jan 3, 1995
Grant Date -
N/A
app pub date -
Nov 29, 1993
filing date -
Nov 27, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for producing a printed circuit board is disclosed, in which use is made of a copper-clad laminate comprising a substrate and, superimposed thereon, a copper foil having its entire surface covered with a solder foil. A solder foil 4 is applied to cover the entire surface of a copper foil 2 superimposed on a substrate 1 (the copper foil 2 and the substrate 1 forming a copper-clad laminate 3). An etching resist is applied to the surface of the solder foil 4, and the solder foil 4 and the copper foil 2 are simultaneously etched to form a conductor circuit pattern 8. Thereafter, the etching resist is stripped off, and unneeded portions of the solder foil 4 are removed on the conductor circuit pattern 8 to thereby produce a printed circuit board. The above process of the invention facilitates soldering operation for the printed circuit board and reduces the production cost thereof.
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