Boride materials for electronic elements and method of preparing the same

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United States of America Patent

PATENT NO 5376309
SERIAL NO

08116534

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Abstract

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Disclosed is a boride material for electronic elements, which is represented by a chemical formula of A.sub.1-x E.sub.x B.sub.12 (where A is Zr of Hf, E is Sc or Y, and 0.1.ltoreq.x.ltoreq.0.9) and the crystal system of which is a cubic one at a temperature not lower than its phase transition temperature and is a hexagonal one at a temperature not higher than its phase transition temperature. The boride material is prepared by mixing oxide powders or sulfate powders of the constitutive elements A and E and a boron powder followed by shaping the powder mixture and then sintering the shaped body.

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Patent Owner(s)

Patent OwnerAddress
HOKKAIDO ELECTRIC POWER COMPANY INCORPORATED (25%)2 HIGASHI 1-CHOME OHDORI CHUO-KU SAPPORO-SHI HOKKAIDO
NEW ENERGY AND INDUSTRIAL TECHNOLOGY DEVELOPMENT ORGANIZATION (50%)SUNSHINE 60 BLDG 3-1-1 HIGASHI IKEBUKURO TOSHIMA-KU TOKYO
INTERNATIONAL SUPERCONDUCTIVITY TECHNOLOGY CENTER (25%)34-3 SHINBASHI 5-CHOME MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hamada, Kazuyuki Tokyo, JP 34 485
Kubo, Kohichi Tokyo, JP 30 396
Matsuura, Kiyotaka Tokyo, JP 5 25
Sugii, Nobuyuki Tokyo, JP 68 714
Wakata, Mitsunobu Tokyo, JP 5 49
Yamauchi, Hisao Tokyo, JP 30 60

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