Method and apparatus for selective electroplating of metals on products
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United States of America Patent
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Dec 13, 1994
Grant Date -
N/A
app pub date -
Sep 11, 1992
filing date -
Sep 13, 1991
priority date (Note) -
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Abstract
This invention relates to a method and apparatus for selective electroplating of metals on metal or metallized products in an elongated strip. Use is made of an apparatus in which an assembly of a masking belt and the product strip are guided along means for exposing the products to an electrolyte. Masking belt and product strip have been provided with holes distributed in a regular pattern over their respective lengths, while driving means are provided lengthwise transport masking belt and product strip. By means of proximity sensors, signals are obtained which indicate the position of the holes in the masking belt and product strip in positions which, related to the direction of travel of belt and strip are situated up stream and nearby the means for exposing the products to an electrolyte. When the signals obtained from the proximity sensors indicate a deviation from the targeted position of belt and strip in relation to each other, a relative move between masking belt and product strip lengthwise is effectuated by influencing the driving means.
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