Composite substrates and their production

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United States of America Patent

PATENT NO 5369067
SERIAL NO

08018752

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Abstract

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A composite substrate is provided, which comprises a cordierite-anorthite-boron base composite material and has a microstructure with anorthite included in the cordierite phase. This substrate can be used in the form of a circuit substrate, because it has high-enough mechanical strength, a coefficient of thermal expansion close to that of silicon and a decreased dielectric constant and, moreover, can be sintered at a low temperature.

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Patent Owner(s)

Patent OwnerAddress
CHICHIBU CEMENT CO LTDC/O NIPPON KOGYO CLUB BLDG 4-6 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Hiroshi Kumagaya, JP 137 1407
Ismail, Morhudun G M U Kumagaya, JP 1 1
Nakai, Zenjiro Kumagaya, JP 4 30

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