Package clip on heat sink
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United States of America Patent
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-
Nov 22, 1994
Grant Date -
N/A
app pub date -
Sep 27, 1993
filing date -
Sep 27, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat sink-spring clip assembly for mounting on a PQFP electronic package wherein leaf spring legs engage with the outermost diametrically opposed ends of the bumpers on the PQFP, and the assembly is positioned relative to the PQFP package by means of tabs which extend normally downwardly to engage the upper sides of the PQFP well above and out of contact with the electrical leads.
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