Alloy connecting materials for semiconductors
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United States of America Patent
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-
Nov 22, 1994
Grant Date -
N/A
app pub date -
Nov 28, 1990
filing date -
Dec 27, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device constructed by electrically connecting a semiconductor package to a substrate by such a method. The alloy wire is produced by drawing an alloy material produced by quench solidifying an alloy containing Pb, Sn or In as a principal element, and an additive element or additives elements. The tip of the alloy wire is heated to form a ball to be joined to the aluminum alloy wiring line as a bump contact. The Brinell hardness number of the ball is H.sub.B 6 or higher.
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