Three-dimensional electroformed circuitry
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United States of America Patent
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Nov 15, 1994
Issued Date -
N/A
app pub date -
Aug 16, 1993
filing date -
Sep 11, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A pressure-type contact for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers (100) in which one wafer is plated with a raised conductive interconnection feature (122). The electrical circuitry (118, 120) is made on a stainless steel mandrel (10, 10a) having a Teflon pattern (16, 16a) on its surface that allows the desired electrical circuit (30, 32, 34, 30a, 32a, 34a, 78) to be electrolytically plated upon the conductive mandrel surface. The mandrel surface is formed with projecting features in the form of depressions (24, 24a) that will form a series of dots or raised interconnection features on the termination wafers. The mandrel also has projecting posts (76) for providing electrical connection through the substrate.
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