Method for the electrolytic removal of plastic mold flash or bleed from the metal surfaces of semiconductor devices or similar electronic components
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United States of America Patent
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Nov 8, 1994
Grant Date -
N/A
app pub date -
May 21, 1993
filing date -
May 21, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Immersing semiconductor devices and similar electronic components in an aqueous solution of one or more organic solvents, conducting salts and a wetting agent and connecting the components to be cleaned to the negative pole of a source of direct current, of which the positive pole is connected to an anode in the same solution, and passing current through the solution raises the pH of the electrolyte film on the cathodic metal surface to a value whereby the organic solvent causes a softening of the plastic mold flash or bleed, sufficient to enable the hydrogen gas generated simultaneously on the cathode to remove the plastic mold flash or bleed from the metal surfaces.
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