RF heated mold for thermoplastic materials
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United States of America Patent
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Nov 1, 1994
Grant Date -
N/A
app pub date -
Jan 31, 1992
filing date -
Jan 31, 1992
priority date (Note) -
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Abstract
A source of radio frequency energy is applied to a low thermal inertia heating element with high thermal conductivity, such as a spool, for rapidly heating the heating element to settable predetermined temperature, which temperature is maintained essentially constant. The heating element is detachably attached about the die of a mold for transferring heat to the die to form, mold, weld or extrude thermoplastic material placed within the mold. Thermal chokes restrict heat transfer from the die to the remainder of the mold. One or more heat sinks draws and dissipates heat from the thermal chokes to maintain cool zones of the mold. Following the heating cycle, upon termination of application of radio frequency energy to the spool, cooling may be accelerated by directing a stream of gas upon the heating element.
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