High temperature non-metallic expansion joint
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United States of America Patent
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-
Oct 25, 1994
Grant Date -
N/A
app pub date -
Jan 7, 1993
filing date -
Jan 7, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An expansion joint for connecting sections of a duct carrying high temperature gases includes upstream and downstream frame portions connected to the ducts, a peripheral fabric belt connecting the frame portions, and thermal insulation positioned between the belt and a primary internal liner mounted on a frame portion and projecting toward the opposite frame portion. A thermal insulation pillow is positioned between the primary internal liner and the flowpath, and a thermal panel made up of floating segments is positioned between the insulation pillow and the flowpath. At least the upstream frame portion includes a conical member extending at an oblique angle to inner and outer sides of the frame portion. In the illustrated embodiments, a secondary liner is mounted on the opposite frame portion and projects toward the frame portion carrying the primary liner, the primary internal liner being positioned between the secondary internal liner and the gas flowpath. An insulation pillow and thermal panel is also provided on the secondary internal liner.
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