Reflow soldering apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 25, 1994
Issued Date -
N/A
app pub date -
Apr 7, 1993
filing date -
Apr 16, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A reflow soldering apparatus comprises a preheating chamber and a reflow chamber, both of which are furnished with a plurality of means for circulating a hot gas being composed of a cross flow blower, a divergent nozzle, a heater, a temperature sensor, a temperature controller, and a power regulator etc. The cross-flow blowers above a conveyer are arranged in a back to back manner and the blowers beneath the conveyer are arranged in a face to face manner, and soldering is performed by impinging the hot gas upon a circuit substrate being transferred by the conveyer. A reflow soldering apparatus having a small temperature fluctuation in the preheating chamber and the reflow chamber, high reliability in the soldering by maintaining a desired temperature profile, and preferable economy is provided.
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