Thermoplastic resin composition
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United States of America Patent
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Oct 4, 1994
Grant Date -
N/A
app pub date -
Aug 13, 1993
filing date -
Aug 14, 1992
priority date (Note) -
Expired
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Abstract
There is disclosed a thermoplastic resin composition which comprises (a) a polyphenylene ether and (b) a polyamide resin, and (c) 0.01 to 5 parts by weight of an acetal and (d) 0.01 to 5 parts by weight of a Lewis acid based on 100 parts by weight of the above (a) and (b) in total.
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