Stackable interconnection socket
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 27, 1994
Grant Date -
N/A
app pub date -
Dec 23, 1992
filing date -
Dec 23, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A component carrier and mating system is disclosed for aligning and mating closely spaced leads of integrated circuit (IC) packages, which protects the integrated circuit packages and permits easy installation. The system is particularly adapted for aligning and mating integrated circuits which have high pin counts. A carrier assembly (100) aligns for mating and interconnecting at least two integrated circuit packages (102a, 102b) having a plurality of leads extending from the packages. A protective shroud (101) covers the stacked packages to maintain the packages in electrical and mechanical engagement and to assure that no damage occurs to the integrated circuit packages. In one embodiment, a first package is installed on the carrier assembly and coupled with the protective shroud to form a pre-engagement assembly, the pre-engagement assembly is then engaged with a second package mounted on a printed circuit board. Resilient latches (534) on the protective shroud deflect to engage bumpers (210) on the second package to maintain the assembly on the circuit board. An extraction tool facilitates disengagement of the assembly from the second package mounted on the printed circuit board.
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