Microwaveable packaging composition
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 20, 1994
Issued Date -
N/A
app pub date -
Aug 3, 1993
filing date -
Jun 27, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Microwaveable packing compositions exhibiting improved temperature control are provided. These compositions comprise a dielectric substrate having at least a portion of at least one of its surfaces coated with a matrix composition containing susceptor particles as well as particles of a blocking agent selected from the group consisting of calcium salts, zinc salts, zinc oxide, lithopone, silica and titanium dioxide. Also disclosed is a microwaveable ink composition useful for the preparation of such packaging compositions as well as a process for manufacturing such packaging compositions.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully