Plasma CVD method
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United States of America Patent
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Aug 23, 1994
Grant Date -
N/A
app pub date -
Mar 23, 1993
filing date -
Mar 30, 1992
priority date (Note) -
Expired
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Abstract
A plasma CVD method and the device for generating an arc discharging plasma, together with introducing both a material gas and a reactive gas into a vacuum chamber; coating a substrate with a thin film which contains a material gas component and a reactive gas component, said plasma CVD method comprising the steps of: introducing said material gas into a position between the arc discharging plasma and the substrate; and introducing said reactive gas into a space opposite, relative to the arc discharging plasma, to a side whereinto the material gas is introduced.
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