Cooling assembly for an integrated circuit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 9, 1994
Grant Date -
N/A
app pub date -
Sep 30, 1993
filing date -
Sep 30, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A cooling assembly includes a fin, a fan retained above the fin, and a housing. The fin includes a bottom surface for contacting an upper surface of the integrated circuit and an upper surface from which a plurality of ridges extend, each two adjacent ridges defining a channel therebetween. A plurality of venting openings are formed in a top wall of the hollow housing. A plurality of snapping members project downwardly from two mutually facing side walls of the hollow housing and each of which having a distal flexible snapping end for releasably engaging with an underside of the integrated circuit. A pair of ribs are formed in an upper section of each of two mutually facing inner sides of the side walls of the hollow housing, the distance between opposite ribs being equal to a width of the integrated circuit. A plurality of oblique flexible pieces extend from an inner side of the top wall of the hollow housing. A groove is formed in an outer side of each of two outermost ridges and extends along a longitudinal direction of the ridges, and a protrusion is formed in a lower section of each of two mutually facing inner sides of the side walls of the hollow housing for engaging with an associated groove.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully