Screen printing apparatus for filling through-holes in circuit board with paste
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United States of America Patent
Stats
-
Jul 26, 1994
Grant Date -
N/A
app pub date -
Aug 18, 1992
filing date -
Aug 23, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a screen printing apparatus for filling minute through-holes in a board with conductive paste or the like by screen printing. When screen printing is performed with this screen printing apparatus, the board is placed on a stage through the intermediation of a film which is supplied to the stage by means of adhesive pads. The adhesive pads are brought into contact with the uppermost one of a plurality of stacked films to catch it by adhesion and then transfer the film to a position above the stage. Films are caught one after another by adhesion.
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